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MAX2022
Absolute Maximum Ratings
VCC_ to GND .......................................................-0.3V to +5.5V
BBIP, BBIN, BBQP, BBQN to GND .......... -2.5V to (V CC + 0.3V)
LO, RF to GND Maximum Current .....................................50mA
RF Input Power ..............................................................+20dBm
Baseband Differential I/Q Input Power ...........................+20dBm
LO Input Power ..............................................................+10dBm
RBIASLO1 Maximum Current ............................................10mA
RBIASLO2 Maximum Current ............................................10mA
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
RBIASLO3 Maximum Current ............................................10mA
Continuous Power Dissipation (Note 1) .............................. 7.6W
Operating Case Temperature Range (Note 2) ... -40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: Based on junction temperature T J = T C + (θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
TQFN
Junction-to-Ambient
Thermal Resistance (θ JA ) (Notes 3, 4) .....................+34°C/W
Junction-to-Case
Thermal Resistance (θ JC ) (Notes 1, 4) ....................+8.5°C/W
Note 3: Junction temperature T J = T A + (θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
DC Electrical Characteristics
(MAX2022 Typical Application Circuit , V CC = 4.75V to 5.25V, V GND = 0V, I/Q ports terminated into 50? to GND, LO and RF ports
terminated into 50? to GND, R1 = 432?, R2 = 562?, R3 = 301?, T C = -40°C to +85°C, unless otherwise noted. Typical values are at
V CC = 5V, T C = +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Total Supply Current
Total Power Dissipation
V CC
I TOTAL
Pins 3, 13, 15, 31, 33 all connected to V CC
4.75
5.00
292
1460
5.25
342
1796
V
mA
mW
Recommended AC Operating Conditions
PARAMETER
RF Frequency
LO Frequency
SYMBOL
f RF
f LO
(Note 5)
(Note 5)
CONDITIONS
MIN
1500
1500
TYP
MAX
3000
3000
UNITS
MHz
MHz
IF Frequency
LO Power Range
f IF
P LO
(Note 5)
-3
1000
+3
MHz
dBm
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